1. 14LPP, 12FDX ™ , GF PRODUCTS 130nm – 55LPx, 22FDX ® (FD-SOI) 40LP, 28SLP, 22FDX (FD-SOI) 7nm and below I oT Power efficiency and performance on silicon-proven technology The rise of IoT and the Cloud and their associated technolo - gies and platforms are slowly but surely fueling the emergence of new market segments that are shaping our way of life. The versatility of the devices combined with the power of networks and data centers to marshal the data for end- spaces is transforming pervasive computing to intelligent computing. The IoT applications and use-cases that span clients/devices, networks, and data centers drive new requirements for semiconductors including low power, low leakage, smaller and denser packaging, and cost effectiveness. These requirements are at the heart of the “under-the-hood” differentiated technol - ogies and products developed by GLOBALFOUNDRIES that feature low-power, cost-effective performance, RF, embedded memory, analog/power, and packaging. By forging long-view relationships with customers and part - ners to design and develop optimized solutions and driving excellence in execution – high yields and time-to-market, we all have a direct role in delivering enhanced experiences and realizing the full potential of the IoT. 8/16-bit ARM Cortex M0+ to M3/M4 Bluetooth® Smart (BLE) / 15.4, Zigbee – typically off-chip 0-100mA, Standalone Linear Regulators COMPUTE CONNECTIVITY ANALOG-POWER 32/64-bit ARM Cortex A9+ BLE / 15.4, Wi-Fi, USB; LTE Cat 1/ M /NB-IoT → 5G – External 600mA-8A, PMICs, Smart Power 16/32-bit ARM Cortex M3/M4 to Cortex A9 BLE /15.4, Zigbee, Wi-Fi – Integrated Cellular LTE Cat 1 / M – External (optional) 50mA-1A, multi-rail Power Management Units LOW Sensing & Actuators MID Collecting & Routing HIGH Application Compute & Vision • Low power processes > Optimal power consumption • Wireless IoT Connectivity > Cellular, WiFi, and emerging communication protocols • Integrated Sensors and Analog > Smart sensors, on-board analog, embedded memory solutions, energy harvesting, short burst battery usage, solar • IP Support and Security > ARM cores, foundation IP, and complex cores across multiple technologies. Certified foundry, crypto engines, key vaults • Multi-chip integration and Packaging > In-house packaging solutions complement OSAT partnerships for smaller, thinner, and simpler form factors Key Applications Edge Gateways High-end Smart Watch ISP / Vision Processing Smart Vending AI AR / VR Drones Health and Fitness Monitors Health and Fitness Monitors Wearables Home Security Wireless Smart Meters Asset Trackers Smart Clothing IIoT Factory Controllers Automotive Infotainment, ADAS

2. Available In Development External / 3rd Party Contact GF for latest availability / support Sensing & Actuators Collecting & Routing Application Compute & Vision LOW MID HIGH GF Capabilities for IoT Key IoT Requirement 130nm 55nm LPx 40nm LP 28nm SLP 22FDX ® 14nm LPP Compute (MCU class) 8-/16-bit (ARM Cortex M0+ to M3/M4, up to 250MHz) 16-/32-bit (ARM Cortex M3/M4 to Cortex A9, up to 1GHz) 32-/64-bit (ARM Cortex A9+, Above 1GHz+) Memory OTP MTP eFuse eFlash eMRAM Stacked die LV-SRAM Battery life 1-30 days eg. Wearables 1 year eg. Smoke detector, Building sensor 10 years eg. Water & gas meters Connectivity (/w RF integration) BLE / 802.15.4 WiFi 802.11 b/g/n GNSS/GPS NFC LTE Cat M / NB-IoT 5G / mmWave (5G) Security Authorization (RTL) Crypto (RTL) Secure key gen and vault Operating Temperature -20C to +65C (medical) 0C to +70C/85C (commercial) -40C to +85C (industrial) -40C to +105C (automotive) -40C to +125C (automotive extended) Packaging 2D (FC BGA/ FC CSP) WLP (Fan-in, Fan-out) 2.5D (SiP) Active & Standby Active power Ref: for ARM A7 @800MHz, 22FDX is 50% lower vs 28SLP (Source: Verisilicon); For ARM A9/NEON @150-250MHz, 22FDX is 86-88% lower vs 40LP (Source: GF internal) Standby power Ref: 1pA/cell for 22FDX; actual or relative power savings are application dependent Sensors, Display Supply Voltage (Vdd) 1.2V, 1.5V 0.9V, 1.2V 0.9V, 1.1V, 1.2V, 9V, 12V 0.8V, 1.0V, 1.1V 0.4V, 0.5V, 0.65V, 0.8V 0.8V I/O Voltage 1.5V, 2.5V, 3.3V, 5V, 15V 1.8V, 2.5V, 3.3V, 5V 1.5V, 1.8V, 2.5V, 3.3V 1.5V, 1.8V, 2.5V, 3.3V 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 1.2V, 1.5V, 1.8V Multiple Vt's 3@1.2V, 2@0.9V 5 @0.9V 5 @1.0V, 4 @0.8V 4 4 Superior Analog/RF integration (high fT/fMAX)

4. Mixed-technology solutions based on proven processes Performance/ power/cost optimized Mature Mainstream Leading Edge 130/180nm 55/65nm 40nm 28nm HKMG Highest performance & power efficient 14LPP 22FDX ® Cost-effective performance for connected and low-power embedded applications 12FDX Full-node scaling, ultra-low power & performance on demand Highest density & performance 7nm FinFET AVAILABLE This document, including any details regarding GLOBALFOUNDRIES products and services, is current only as of the date of publication and subject to change by GLOBALFOUNDRIES at any time. All information in this document is provided “AS IS” and without any warranty, express or implied, of any kind. GLOBALFOUNDRIES®, the GLOBALFOUNDRIES logo and combinations thereof, and GLOBALFOUNDRIES’ other trademarks and service marks are owned by GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. All other brand names, product names, or trademarks belong to their respective owners and are used herein solely to identify the products and/or services offered by those trademark owners. ©2017 GLOBALFOUNDRIES Inc. All rights reserved. 2600 Great America Way, Santa Clara, CA 95054 USA Tel: +1 408-462-3900 global foundries.com/contact-us PBIOT-1.0 GF Products – Customer Applications and Solutions Vision Processors 22FDX Camera/ISP 28SLP, 22FDX IoT/RF Transcievers 65RF, 55LPx Low–Mid MCU 55LPx, 28SLP, 22FDX Mid–High MCU/SoC 55LPx, 28SLP, 22FDX WiFi, BLE, GPS 55LPx, 28SLP Wireless Sensors 55LPx Drone IC 180nm, 130nm, 65/55nm Wearables 40LP, 28SLP Voice Processor 28SLP Industrial/ Smart Meters 40LP Product Roadmap for the IoT SoC Market Manufacturing Center T rusted Foundry Design Center R&D Regional O f fice Singapore Leuven Santa Clara San Diego Raleigh Rochester Malta Boston East Fishkill Albany Burlington Bangalore Seoul Beijing Chengdu (2018) Hsinchu Shanghai Kista Amsterdam Geneva Dresden Munich Évry Austin Dallas Y okohama Kyoto Global Presence for Semiconductor Manufacturing

3. IoT—GLOBALFOUNDRIES IP Libraries Description 130nm 55nm LPx 40nm LP 28nm SLP 22FDX 14nm LPP Foundation IP Standard Cells G1 8T/9T/12T G1//2 9T/12T (G0-Dev) 7T/9T/12T 8T/12T 9T/10.5T (7.5T-Dev ) Standard Cells–ULP 8T/9T/12T 8T 7.5T Standard Cells–ULL 7T/9T 8T SRAM Compiler: 1P SRAM Compiler: 2P ROM Compiler Register File:1P Register File: 2P GPIO ESD Non Volatile Memory Electrical Fuse OTP eFlash eMRAM Planning Analog and RF IP Temp Sensor Process Monitor PLL Video DAC Audio ADC / DAC Interface IP DDR 3/2 3/2 3/2 (4-Dev) 4/3 4/3 LPDDR 3/2 3/2 3/2 (4-Dev) 4/3 4/3 USB 2.0/3.x PCle G1/2/3/4 (G1/2) (G1/2) SATA I/II/III (I/II) (I/II) MIPI D-PHY/M-PHY (D-PHY) V-By-One PHY HDMI/DP (HDMI) (HDMI) SerDes (max speed) 6Gbps 6Gbps 12.5Gbps 56Gbps RF IP BLE / 15.4 Planning WiFi 802.11 Planning LTE NB-IoT Planning Power Mgmt IP LDO, DC-DC, RTC Silicon Validated Contact GF for latest IP availability Design Kit Available In Development GLOBALFOUNDRIES offers comprehensive, state-of-the-art design solutions and services that provide a quick, high-quality and cost-ef - fective path to production for your IoT design. GLOBALFOUNDRIES’ Design Enablement team validates our partners’ services and solu - tions with our silicon process technologies to ensure that they meet the highest standards. GLOBALSOLUTIONS ® Design and Manufacturing Ecosystem Libraries (Standard Cells, Memories) Full Suite PDK, Reference Flow Comprehensive Range of Process Technologies SoC Packaging 2.5D and 3D Packaging Analog / Mixed-Signal Processor IP High-speed Interfaces